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XCZU19EG-2FFVC1760E

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Numer producenta:: XCZU19EG-2FFVC1760E

Producent:: Xilinx Inc.

Obudowa:: BGA-1760

Kategoria produktu:: Embedded - System On Chip (SoC)

Opis:: IC FPGA 512 I/O 1760FCBGA

Status RoHS:: Bezołowiowe / zgodne z RoHS

Arkusz danych:: XCZU19EG-2FFVC1760E Datasheet(PDF)

Chcesz szybką wycenę? Wyślij BOM na [email protected]

Obniż koszt dzięki niskim MOQ • Małe zamówienia wysyłane szybko

Opcja dostawy:

Łatwe płatności:

Ilość w magazynie: 6,869

MOQ: 1

Wyślij teraz formularz zapytania dla XCZU19EG-2FFVC1760E lub napisz do nas na [email protected] — odpowiemy z ceną i terminem realizacji w ciągu 12 godzin.

Instrukcje zakupu

Dyethin oferuje konkurencyjne ceny XCZU19EG-2FFVC1760E komponentów, gwarantując, że każdy komponent jest w 100% oryginalny i nowy, wyprodukowany przez Xilinx Inc.. Aby uzyskać wycenę dla XCZU19EG-2FFVC1760E, wypełnij szybki formularz zapytania po prawej stronie, podając wymaganą ilość i dane kontaktowe. Nasz zespół sprzedaży odpowie w ciągu 12 godzin z ceną i terminami dostaw.

XCZU19EG-2FFVC1760E includes central processing unit, graphics processor, video codec, display controller, bus controller, memory subsystem, audio processor, input/output subsystem, and various high-speed analog interfaces. These functional modules are integrated onto it to complete complex electronic system functions. In the application of smart devices, Zynq® UltraScale+™ MPSoC EG XCZU19EG-2FFVC1760E is the core component that realizes various intelligent functions.

Features

XCZU19EG-2FFVC1760E has a core processor with Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™ high-performance and low-power characteristics, which can provide powerful computing and control capabilities, and is paired with MCU, FPGA Architecture to achieve highly flexible and customizable system design. It provides various connectivity interfaces, including CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, making it easy to transfer and control data with other peripheral devices such as DMA, WDT. It can also achieve high-speed computing capabilities at 600MHz, 1.5GHz running speed.

The IC XCZU19EG-2FFVC1760E is equipped with - flash memory and 256Kb, which can be used to store program code, data, and configuration information, achieving high-speed data processing capabilities. Xilinx Inc. XCZU19EG-2FFVC1760E adopts the 1760-FCBGA (42.5x42.5) packaging form, which has a small volume and good heat dissipation performance, making it easy to integrate and apply on different electronic products. The operating temperature range of this IC is 0°C ~ 100°C (TJ), and its wide temperature range can adapt to various environments. Its main attributes include Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells being able to achieve high levels of logical functionality and customized design.

Xilinx Inc. manufacturers use the 1760-BBGA, FCBGA production process to manufacture XCZU19EG-2FFVC1760E, and also provide Tray packaging for easy bulk procurement and use.

Applications

● Smartphones

The core component of a smartphone, responsible for handling various tasks such as voice calls, data transmission, graphic display, audio playback, etc.

● Wearable devices

Wearable devices such as smartwatches and health monitors rely on SoC chips to achieve various functions, such as motion tracking, health monitoring, and message notifications.

● Security monitoring

Security monitoring equipment such as cameras, video recorders, etc., achieve real-time video processing and data storage.

● Medical equipment

Monitor, ultrasound equipment, blood analyzer, etc. for high-speed data processing and real-time analysis.

Below is a reference table of express delivery prices and timeframes:

Express Name	Prices within 0.5 kg	Statute of limitations (working days)
DHL	$28.00	3-5 days
FedEx	$30.00	4-6 days
EMS	$25.00	7-15 days
UPS	$30.00	3-6 days
TNT	$29.00	4-7 days

Price Note: The price is an example within 0.5Kg, the specific cost may be adjusted according to the actual weight and destination.
Timeliness Note: Timeliness is estimated time, excluding customs clearance delays or other uncontrollable factors.
Extra Charges: Remote surcharge may be incurred in some areas, subject to the quotation of the logistics company.

1. Can I buy the XCZU19EG-2FFVC1760E online from Dyethin site?

Yes, you can buy, purchase, or order online the XCZU19EG-2FFVC1760E directly through our website. We offer a secure checkout for fast and easy ordering.

2. Is the XCZU19EG-2FFVC1760E currently in stock and ready to ship?
Absolutely! The XCZU19EG-2FFVC1760E is in stock, available now, and ready to ship. We provide same-day shipping for all orders placed before our daily cutoff time.

3. Do you offer bulk pricing or wholesale discounts on the XCZU19EG-2FFVC1760E?
Yes, we offer attractive bulk pricing, wholesale, and volume discounts on the XCZU19EG-2FFVC1760E. For larger quantity orders, request an instant quote directly from our price list.

4. Do you provide XCZU19EG-2FFVC1760E components through trusted supply networks?
We supply XCZU19EG-2FFVC1760E voltage regulators from Xilinx Inc. through trusted global sourcing channels, ensuring consistent quality and performance.

5. Can I find technical specifications or a datasheet for the XCZU19EG-2FFVC1760E?
Certainly! The complete technical specifications and datasheet for the XCZU19EG-2FFVC1760E are readily available and clearly listed on our product page.

6. How competitive is your pricing for the XCZU19EG-2FFVC1760E compared to other suppliers?
Our pricing on the XCZU19EG-2FFVC1760E is highly competitive, cost-effective, and consistently reviewed to ensure you get excellent value for your purchase.

7. Can I get fast delivery or bulk purchase discounts when buying XCZU19EG-2FFVC1760E components?
Yes, we offer flexible fast delivery, competitive bulk pricing, and attractive discounts for larger purchase quantities. Contact us directly for your bulk purchasing requirements.

Specyfikacje

Kategoria produktu :

Embedded - System On Chip (SoC)

Producent :

Xilinx Inc.

Product type :

Integrated Circuits (ICs)

Architecture :

MCU, FPGA

Connectivity :

CAN, EBI/EMI, Ethernet, I²C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Quad ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™

Flash Size :

Operating Temperature :

0°C ~ 100°C (TJ)

Package / Case :

1760-BBGA, FCBGA

Packaging :

Tray

Part Status :

Active

Peripherals :

DMA, WDT

Primary Attributes :

Zynq®UltraScale+™ FPGA, 1143K+ Logic Cells

RAM Size :

256Kb

Series :

Zynq® UltraScale+™ MPSoC EG

Speed :

600MHz, 1.5GHz

Supplier Device Package :

1760-FCBGA (42.5x42.5)

Usługa montażu PCB

Dyethin PCB Assembly Service for the XCZU19EG-2FFVC1760E simplifies component integration in just three easteps: request your quote, confirm pricing, and begin assembly. Purchase components seamlessly, enjoycost-effective pricing, fast turnaround, and reliable quality assurance from a trusted supplier-ensuring youassembled circuils perform exactly as specified.

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Ilość w magazynie: 6,869

MOQ: 1

Wyślij teraz formularz zapytania dla XCZU19EG-2FFVC1760E lub napisz do nas na [email protected] — odpowiemy z ceną i terminem realizacji w ciągu 12 godzin.

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