XCVP1102-2LLEVSVA2785

XCVP1102-2LLEVSVA2785 includes central processing unit, graphics processor, video codec, display controller, bus controller, memory subsystem, audio processor, input/output subsystem, and various high-speed analog interfaces. These functional modules are integrated onto it to complete complex electronic system functions. In the application of smart devices, Versal® Premium XCVP1102-2LLEVSVA2785 is the core component that realizes various intelligent functions.

Features

XCVP1102-2LLEVSVA2785 has a core processor with Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ high-performance and low-power characteristics, which can provide powerful computing and control capabilities, and is paired with MPU, FPGA Architecture to achieve highly flexible and customizable system design. It provides various connectivity interfaces, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, making it easy to transfer and control data with other peripheral devices such as DDR, DMA, PCIe. It can also achieve high-speed computing capabilities at 450MHz, 1.08GHz running speed.

The IC XCVP1102-2LLEVSVA2785 is equipped with - flash memory and 256Kb, which can be used to store program code, data, and configuration information, achieving high-speed data processing capabilities. AMD XCVP1102-2LLEVSVA2785 adopts the 2785-FCBGA (50x50) packaging form, which has a small volume and good heat dissipation performance, making it easy to integrate and apply on different electronic products. The operating temperature range of this IC is 0°C ~ 110°C (TJ), and its wide temperature range can adapt to various environments. Its main attributes include Versal™ Premium FPGA, 1.575M Logic Cells being able to achieve high levels of logical functionality and customized design.

AMD manufacturers use the 2785-BFBGA, FCBGA production process to manufacture XCVP1102-2LLEVSVA2785, and also provide Tray packaging for easy bulk procurement and use.

Applications

● Smartphones

The core component of a smartphone, responsible for handling various tasks such as voice calls, data transmission, graphic display, audio playback, etc.

● Wearable devices

Wearable devices such as smartwatches and health monitors rely on SoC chips to achieve various functions, such as motion tracking, health monitoring, and message notifications.

● Security monitoring

Security monitoring equipment such as cameras, video recorders, etc., achieve real-time video processing and data storage.

● Medical equipment

Monitor, ultrasound equipment, blood analyzer, etc. for high-speed data processing and real-time analysis.