Zdjęcie ma charakter poglądowy. Specyfikacje są oparte na datasheet (PDF).

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XCVM1302-1LSENBVB1024

Name: XCVM1302-1LSENBVB1024
Brand: AMD
SKU: XCVM1302-1LSENBVB1024
Availability: InStock

Get $29 off orders over $999.

For orders over $2,999, get $160 off.

For orders over $6999, you will receive a $290 discount.

Numer producenta:: XCVM1302-1LSENBVB1024

Producent:: AMD

Obudowa:: BGA-1024

Kategoria produktu:: Embedded - System On Chip (SoC)

Opis:: Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ System On Chip (SOC) IC Versal™ Prime Versal™ Prime FPGA, 70k Logic Cells 400MHz, 1GHz 1024-BGA (31x31)

Status RoHS:

Arkusz danych:: XCVM1302-1LSENBVB1024 Datasheet(PDF)

Chcesz szybką wycenę? Wyślij BOM na [email protected]

Obniż koszt dzięki niskim MOQ • Małe zamówienia wysyłane szybko

Opcja dostawy:

Łatwe płatności:

Ilość w magazynie: 1,112

MOQ: 1

Wyślij teraz formularz zapytania dla XCVM1302-1LSENBVB1024 lub napisz do nas na [email protected] — odpowiemy z ceną i terminem realizacji w ciągu 12 godzin.

Instrukcje zakupu

Dyethin oferuje konkurencyjne ceny XCVM1302-1LSENBVB1024 komponentów, gwarantując, że każdy komponent jest w 100% oryginalny i nowy, wyprodukowany przez AMD. Aby uzyskać wycenę dla XCVM1302-1LSENBVB1024, wypełnij szybki formularz zapytania po prawej stronie, podając wymaganą ilość i dane kontaktowe. Nasz zespół sprzedaży odpowie w ciągu 12 godzin z ceną i terminami dostaw.

XCVM1302-1LSENBVB1024 includes central processing unit, graphics processor, video codec, display controller, bus controller, memory subsystem, audio processor, input/output subsystem, and various high-speed analog interfaces. These functional modules are integrated onto it to complete complex electronic system functions. In the application of smart devices, Versal™ Prime XCVM1302-1LSENBVB1024 is the core component that realizes various intelligent functions.

Features

XCVM1302-1LSENBVB1024 has a core processor with Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™ high-performance and low-power characteristics, which can provide powerful computing and control capabilities, and is paired with MPU, FPGA Architecture to achieve highly flexible and customizable system design. It provides various connectivity interfaces, including CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG, making it easy to transfer and control data with other peripheral devices such as DDR, DMA, PCIe. It can also achieve high-speed computing capabilities at 400MHz, 1GHz running speed.

The IC XCVM1302-1LSENBVB1024 is equipped with - flash memory and -, which can be used to store program code, data, and configuration information, achieving high-speed data processing capabilities. AMD XCVM1302-1LSENBVB1024 adopts the 1024-BGA (31x31) packaging form, which has a small volume and good heat dissipation performance, making it easy to integrate and apply on different electronic products. The operating temperature range of this IC is 0°C ~ 100°C (TJ), and its wide temperature range can adapt to various environments. Its main attributes include Versal™ Prime FPGA, 70k Logic Cells being able to achieve high levels of logical functionality and customized design.

AMD manufacturers use the 1024-BFBGA production process to manufacture XCVM1302-1LSENBVB1024, and also provide Tray packaging for easy bulk procurement and use.

Applications

● Smartphones

The core component of a smartphone, responsible for handling various tasks such as voice calls, data transmission, graphic display, audio playback, etc.

● Wearable devices

Wearable devices such as smartwatches and health monitors rely on SoC chips to achieve various functions, such as motion tracking, health monitoring, and message notifications.

● Security monitoring

Security monitoring equipment such as cameras, video recorders, etc., achieve real-time video processing and data storage.

● Medical equipment

Monitor, ultrasound equipment, blood analyzer, etc. for high-speed data processing and real-time analysis.

Below is a reference table of express delivery prices and timeframes:

Express Name	Prices within 0.5 kg	Statute of limitations (working days)
DHL	$28.00	3-5 days
FedEx	$30.00	4-6 days
EMS	$25.00	7-15 days
UPS	$30.00	3-6 days
TNT	$29.00	4-7 days

Price Note: The price is an example within 0.5Kg, the specific cost may be adjusted according to the actual weight and destination.
Timeliness Note: Timeliness is estimated time, excluding customs clearance delays or other uncontrollable factors.
Extra Charges: Remote surcharge may be incurred in some areas, subject to the quotation of the logistics company.

1. Can I buy the XCVM1302-1LSENBVB1024 online from Dyethin site?

Yes, you can buy, purchase, or order online the XCVM1302-1LSENBVB1024 directly through our website. We offer a secure checkout for fast and easy ordering.

2. Is the XCVM1302-1LSENBVB1024 currently in stock and ready to ship?
Absolutely! The XCVM1302-1LSENBVB1024 is in stock, available now, and ready to ship. We provide same-day shipping for all orders placed before our daily cutoff time.

3. Do you offer bulk pricing or wholesale discounts on the XCVM1302-1LSENBVB1024?
Yes, we offer attractive bulk pricing, wholesale, and volume discounts on the XCVM1302-1LSENBVB1024. For larger quantity orders, request an instant quote directly from our price list.

4. Do you provide XCVM1302-1LSENBVB1024 components through trusted supply networks?
We supply XCVM1302-1LSENBVB1024 voltage regulators from AMD through trusted global sourcing channels, ensuring consistent quality and performance.

5. Can I find technical specifications or a datasheet for the XCVM1302-1LSENBVB1024?
Certainly! The complete technical specifications and datasheet for the XCVM1302-1LSENBVB1024 are readily available and clearly listed on our product page.

6. How competitive is your pricing for the XCVM1302-1LSENBVB1024 compared to other suppliers?
Our pricing on the XCVM1302-1LSENBVB1024 is highly competitive, cost-effective, and consistently reviewed to ensure you get excellent value for your purchase.

7. Can I get fast delivery or bulk purchase discounts when buying XCVM1302-1LSENBVB1024 components?
Yes, we offer flexible fast delivery, competitive bulk pricing, and attractive discounts for larger purchase quantities. Contact us directly for your bulk purchasing requirements.

Specyfikacje

Kategoria produktu :

Embedded - System On Chip (SoC)

Producent :

AMD

Product type :

Integrated Circuits (ICs)

Architecture :

MPU, FPGA

Connectivity :

CANbus, EBI/EMI, Ethernet, I2C, MMC/SD/SDIO, SPI, UART/USART, USB OTG

Core Processor :

Dual ARM® Cortex®-A72 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5F with CoreSight™

Flash Size :

Manufacturer Lead Weeks :

Operating Temperature :

0°C ~ 100°C (TJ)

Package / Case :

1024-BFBGA

Packaging :

Tray

Part Status :

Active

Peripherals :

DDR, DMA, PCIe

Primary Attributes :

Versal™ Prime FPGA, 70k Logic Cells

RAM Size :

Series :

Versal™ Prime

Speed :

400MHz, 1GHz

Supplier Device Package :

1024-BGA (31x31)

Usługa montażu PCB

Dyethin PCB Assembly Service for the XCVM1302-1LSENBVB1024 simplifies component integration in just three easteps: request your quote, confirm pricing, and begin assembly. Purchase components seamlessly, enjoycost-effective pricing, fast turnaround, and reliable quality assurance from a trusted supplier-ensuring youassembled circuils perform exactly as specified.

1. Request Quote

Request a quote from Dyethin to order electronic parts.

2. PCB Assembly

Communicate PCB assembly details and place PCBA orders.

3. Quality Assurance

Passed Dyethin high reliability test, quality assurance.

Wybór specyfikacji PCB

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Akceptuje pliki Gerber; obsługuje przesyłanie projektu PCB w formatach ZIP/RAR (maks. 30MB).

Ilość w magazynie: 1,112

MOQ: 1

Wyślij teraz formularz zapytania dla XCVM1302-1LSENBVB1024 lub napisz do nas na [email protected] — odpowiemy z ceną i terminem realizacji w ciągu 12 godzin.

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