Clock and Timer - Delay Lines

    Zdjęcia i modele
  • DS1005-125+

    Maxim Integrated
    Package/Case:14-DIP (0.300", 7.62mm)
  • Magazyn
  • 9,560
    W magazynie
  • Cena jednostkowa
  • Rohs
  • ROHS
  • Opis
  • 25ns Signal Delay Components Nonprogrammable Through Hole
  • Arkusz danych
  • RFQ
  • RFQ Dodaj do BOM
  • DS1110LE-75+

    Maxim Integrated
    Package/Case:14-TSSOP (0.173", 4.40mm Width)
  • 10,638
    W magazynie
  • ROHS
  • IC DELAY LINE 10TAP 14-TSSOP
  • RFQ Dodaj do BOM
  • DS1110LE-60+

    Maxim Integrated
    Package/Case:14-TSSOP (0.173", 4.40mm Width)
  • 7,835
    W magazynie
  • ROHS
  • IC DELAY LINE 10TAP 14-TSSOP
  • RFQ Dodaj do BOM
  • DS1110E-125+

    Maxim Integrated
    Package/Case:14-TSSOP (0.173", 4.40mm Width)
  • 11,435
    W magazynie
  • ROHS
  • IC DELAY LN 10TAP 125NS 14TSSOP
  • RFQ Dodaj do BOM
  • DS1110LE-80+

    Maxim Integrated
    Package/Case:14-TSSOP (0.173", 4.40mm Width)
  • 11,868
    W magazynie
  • ROHS
  • IC DELAY LINE 10TAP 14-TSSOP
  • RFQ Dodaj do BOM
  • SY605JZ TR

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 12,895
    W magazynie
  • ROHS
  • IC DELAY LINE 255TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • SY605JZ

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 8,555
    W magazynie
  • ROHS
  • IC DELAY LINE 255TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • MC100E196FNR2G

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 11,409
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC100E196FNR2

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 8,468
    W magazynie
  • ROHS
  • IC DELAY LINE 128TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • MC100E196FNG

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 10,002
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC100E196FN

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 10,357
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC100E195FNR2G

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 11,412
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC100E195FNR2

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 6,702
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • DS1110S-175+

    Maxim Integrated
    Package/Case:16-SOIC (0.295", 7.50mm Width)
  • 10,481
    W magazynie
  • ROHS
  • IC DELAY LINE 10TAP 175NS 16SOIC
  • RFQ Dodaj do BOM
  • DS1100M-75+

    Maxim Integrated
    Package/Case:8-DIP (0.300", 7.62mm)
  • 9,470
    W magazynie
  • ROHS
  • 15ns Signal Delay Components Nonprogrammable Through Hole
  • RFQ Dodaj do BOM
  • DS1100M-60+

    Maxim Integrated
    Package/Case:8-DIP (0.300", 7.62mm)
  • 7,721
    W magazynie
  • ROHS
  • 12ns Signal Delay Components Nonprogrammable Through Hole
  • RFQ Dodaj do BOM
  • DS1100M-500+

    Maxim Integrated
    Package/Case:8-DIP (0.300", 7.62mm)
  • 9,175
    W magazynie
  • ROHS
  • 100ns Signal Delay Components Nonprogrammable Through Hole
  • RFQ Dodaj do BOM
  • MC10E195FNR2

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 11,940
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC10E196FN

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 9,613
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC10E196FNG

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 11,299
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • SY55856UHG-TR

    Microchip Technology
    Package/Case:32-TQFP Exposed Pad
  • 11,391
    W magazynie
  • ROHS
  • 50ps Signal Delay Components Multiple, NonProgrammable Surface Mount
  • RFQ Dodaj do BOM
  • SY55856UHG

    Microchip Technology
    Package/Case:32-TQFP Exposed Pad
  • 13,646
    W magazynie
  • ROHS
  • 50ps Signal Delay Components Multiple, NonProgrammable Surface Mount
  • RFQ Dodaj do BOM
  • SY10E196JZ TR

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 10,650
    W magazynie
  • ROHS
  • IC DELAY LINE 7TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • SY10E196JZ

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 8,313
    W magazynie
  • ROHS
  • IC DELAY LINE 7TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • SY10E195JZ-TR

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 9,398
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • SY100E196JY

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 10,218
    W magazynie
  • ROHS
  • IC DELAY LINE 7TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • SY100E195JY TR

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 8,267
    W magazynie
  • ROHS
  • IC DELAY LINE 128TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • SY100E195JY

    Microchip Technology
    Package/Case:28-LCC (J-Lead)
  • 12,279
    W magazynie
  • ROHS
  • IC DELAY LINE 128TAP PROG 28PLCC
  • RFQ Dodaj do BOM
  • MC10E196FNR2G

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 10,778
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM
  • MC10E196FNR2

    ON Semiconductor
    Package/Case:28-LCC (J-Lead)
  • 9,365
    W magazynie
  • ROHS
  • 1.39ns Signal Delay Components Programmable Surface Mount
  • RFQ Dodaj do BOM